The completion of the transaction involving DOMO Engineered Materials opens the way for integration with RadiciGroup businesses acquired by Lone Star Funds. The emerging platform is intended to operate as a global, independent compounder serving multiple end markets.
At Smart Plastics 2026 in Milan, Envalior is presenting material solutions for e-mobility and the electrical and electronics sector, including applications for EV motors, high-voltage charging and AI servers.
Ampacet will present the latest masterbatch solutions for key markets at Equiplast held June 2-5, 2026, in Barcelona, Spain. Visit Hall 3, Booth B116 to explore the broad Ampacet portfolio of advanced masterbatch solutions tailored for critical industries.
Kontron eSystems has started up five new injection molding cells in Leipzig supplied by Wittmann, including two lines with an IMD process. The investment is intended to support the production of wall box housings with demanding surface requirements and short cycle times.
Envalior announces it will present material solutions at Chinaplas 2026, covering applications in mobility, electrical and electronics, and consumer goods. The company highlights its bio- and recycled-based materials portfolio and product development support services.
Sirmax’s filled polypropylene resin ISOFIL H 20 TP F HS BK has been approved by RecyClass as fully compatible with industrial filled-PP recycling processes in Europe. The assessment was based on the protocol for resins used in automotive and EEE applications.
At Chinaplas 2026 in Shanghai, RadiciGroup High Performance Polymers is presenting its portfolio of engineering polymers for automotive, e-mobility, electrical and electronics, as well as industrial and consumer applications. The company is highlighting circular solutions, materials based on renewable feedstock and its local manufacturing base in China.
At Chinaplas 2026 in Shanghai, Mocom will present a portfolio of advanced thermoplastic compounds for automotive, electronics, and sports and leisure applications. The company will showcase, among other things, lighting materials, recycled-content solutions, and lightweight flame-retardant compounds.
DOMO Engineered Materials will showcase at Plastindia 2026 reinforced polyamide-based materials for applications requiring low weight, flame and heat resistance, sustainability and water contact.
Syensqo and Korean company Innores are implementing Tecnoflon FFKM NFS perfluoroelastomers in sealing components for semiconductor manufacturing processes, combining high chemical resistance with the elimination of fluorosurfactants from the PFAS family.
Polyplastics has introduced new Laperos LCP LH and TF series, developed for miniaturization, high flowability and increasing design requirements in electronic components.
At Plastindia 2026 in New Delhi, BOY and its Indian representative Karan Engineering Co. will present an LSR application on a BOY 50 E injection moulding machine, highlighting high-precision processing of liquid silicone rubber for automotive and electronics components.