News Plastech
Plastics are key engineering materials used in automotive, construction, medical and electronic applications, as well as everyday products. Despite their low weight, chemical resistance and ease of processing, plastic products can fail—often unexpectedly—through cracking caused by several interacting factors.
Envalior will present engineering materials for power distribution, connectivity and cooling in AI data centers at Fakuma 2026. The applications include components made from PA46, PA4T PPA, PBT and PPS.
Sirmax will present new certified flame-retardant compounds and the Aria injection-moulding optimisation system at Fakuma 2026. The portfolio includes virgin and recycled-content grades for electrical and electronic applications.
TechnoCompound will present compounds for electrical, electronic and automotive applications at Fakuma 2026. The portfolio includes materials for electromagnetic shielding, electrical insulation and flame retardancy, as well as grades containing recycled materials.
At Fakuma 2026, Syensqo will present specialty polymers for extrusion, injection molding, blow molding, thermoforming, machining, coating and joining processes. Applications will include automotive, data centers, construction, consumer goods and food-contact products.
Avient will introduce non-halogenated flame-retardant polyolefin formulations and recycled polyamide grades at Fakuma 2026. The materials target electrical, electronics and appliance applications subject to stricter fire-safety requirements.
Mocom has introduced Alfater XL A70I 4PA1210, a TPV designed for direct overmolding onto unreinforced and fiber-reinforced PA12. The material is intended for hard-soft components requiring adhesion, sealing performance and coolant resistance.
Bieglo has introduced Gimide polyetherimide from Gharda Polymers to the European market. The range is intended to provide PEI users with an additional sourcing option for demanding industrial applications.
Asahi Kasei will present polymer solutions for automotive, electrical and industrial applications at Fakuma 2026. The exhibits will cover radar antennas, polycarbonate glazing, vehicle interiors, electrical components and metal injection molding.
Envalior will showcase engineering material solutions for automotive, E&E, consumer and industrial applications at Fakuma 2026. The company will also present progress in circular PA6 development and its 360 Innovation Services offering.
Imago Technologies has started series production of the Vision Box AGE-X6, a fanless industrial PC for classical and AI-based machine vision. The platform is designed for machine builders and system integrators requiring scalable computing performance.
Asahi Kasei will showcase polymer material developments at Fakuma 2026, including solutions for automotive radar, battery systems, electrical components, MIM processes and polycarbonate automotive glazing.
SABIC has introduced Ultem DU762 resin, a polyetherimide material designed for smartphone middle frames. The grade is compatible with non-conductive PVD sputtering and is positioned as an alternative to metal and glass fiber-reinforced PC.
Evosys Laser has founded Attosys Laser GmbH in Erlangen to expand its portfolio of laser-based manufacturing processes. The subsidiary focuses on glass processing, material joining and precision machining for demanding applications.
Jiangxi Cable is using Sikora X-RAY 8000 Advanced and X-RAY 8700 NXT systems on two new VCV lines for 500 kV extra-high voltage cables. The equipment supports in-line measurement and control of wall thickness, eccentricity and diameter.
BASF presents Green Energy Manufacturing as part of its Engineering Plastics Sustainability Toolbox. The approach uses renewable energy carriers in chemical production to reduce product carbon footprints without changes to established processes or specifications.
Trelleborg Sealing Solutions has expanded its European production center in Malta to support semiconductor customers. The facility adds cleanroom capacity and will focus on FKM and FFKM products, including new fluorosurfactant-free materials.
Omya Performance Polymer Distribution is expanding its partnership with EMS Grivory to the United Kingdom and Ireland. From 1 July 2026, the agreement will include an exclusive distribution mandate for specialized high-performance polyamides in these markets.
SI Group and Shengxiao Group have established Shengnova Advanced Materials to accelerate the expansion of biphenol production capacity in China. The project is intended to increase regional supply of the material for customers across Asia-Pacific.
SABIC has introduced the LNP Elcrin DC0051RC1 compound with 75% post-consumer recycled content. The polycarbonate-based material combines a high PCR share with mechanical performance and flame retardancy for consumer electronics housings.
At Plast 2026, RadiciGroup High Performance Polymers will present solutions for automotive, e-mobility, electrical and electronics, and water management applications. The company is highlighting co-design, metal replacement, and materials with a documented environmental profile.
Avient is introducing new Therma-Tech thermally conductive formulations containing natural graphite. The materials will be presented at FIP in Lyon and Equiplast in Barcelona, alongside the company’s broader portfolio of polymer solutions.
Omya Performance Polymer Distribution has become SK Chemicals’ distribution partner for SkypeL TPE-E thermoplastic polyester elastomers in European markets. The agreement will take effect on July 1, 2026 and covers sales, technical support and application development.
Weidmüller uses BASF's polyphthalamide Ultramid Advanced N3U41 G6 in PCB connectors and terminals from the Omnimate 4.0 family. The material is intended to provide heat resistance for reflow soldering, dimensional stability and broad colouring options.
Asahi Kasei has developed a photosensitive polyimide PSPI film for advanced panel-level semiconductor packaging. The material is intended to improve the lamination of large panels and support the formation of a greater number of insulating layers.
The completion of the transaction involving DOMO Engineered Materials opens the way for integration with RadiciGroup businesses acquired by Lone Star Funds. The emerging platform is intended to operate as a global, independent compounder serving multiple end markets.
At Smart Plastics 2026 in Milan, Envalior is presenting material solutions for e-mobility and the electrical and electronics sector, including applications for EV motors, high-voltage charging and AI servers.
Ampacet will present the latest masterbatch solutions for key markets at Equiplast held June 2-5, 2026, in Barcelona, Spain. Visit Hall 3, Booth B116 to explore the broad Ampacet portfolio of advanced masterbatch solutions tailored for critical industries.
Kontron eSystems has started up five new injection molding cells in Leipzig supplied by Wittmann, including two lines with an IMD process. The investment is intended to support the production of wall box housings with demanding surface requirements and short cycle times.
Envalior announces it will present material solutions at Chinaplas 2026, covering applications in mobility, electrical and electronics, and consumer goods. The company highlights its bio- and recycled-based materials portfolio and product development support services.
Sirmax’s filled polypropylene resin ISOFIL H 20 TP F HS BK has been approved by RecyClass as fully compatible with industrial filled-PP recycling processes in Europe. The assessment was based on the protocol for resins used in automotive and EEE applications.
At Chinaplas 2026 in Shanghai, RadiciGroup High Performance Polymers is presenting its portfolio of engineering polymers for automotive, e-mobility, electrical and electronics, as well as industrial and consumer applications. The company is highlighting circular solutions, materials based on renewable feedstock and its local manufacturing base in China.
At Chinaplas 2026 in Shanghai, Mocom will present a portfolio of advanced thermoplastic compounds for automotive, electronics, and sports and leisure applications. The company will showcase, among other things, lighting materials, recycled-content solutions, and lightweight flame-retardant compounds.
DOMO Engineered Materials will showcase at Plastindia 2026 reinforced polyamide-based materials for applications requiring low weight, flame and heat resistance, sustainability and water contact.
Syensqo and Korean company Innores are implementing Tecnoflon FFKM NFS perfluoroelastomers in sealing components for semiconductor manufacturing processes, combining high chemical resistance with the elimination of fluorosurfactants from the PFAS family.
Polyplastics has introduced new Laperos LCP LH and TF series, developed for miniaturization, high flowability and increasing design requirements in electronic components.